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| Interconnect Structures Technology |
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Feature Description |
Standard |
Advanced |
Development |
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| Standard PWB |
Line width-External (.5oz start) |
4 |
3.5 |
2.5 |
| Spacing-External (.5oz start) |
4 |
3.5 |
2.75 |
| Drill diameter-thru hole |
10 |
8 |
6 |
| Drill aspect ratio |
12:1 |
15:1 |
20:1 |
| Land diameter-thru hole external |
20 |
18 |
16 |
| Land diameter-thru hole internal |
20 |
18 |
16 |
| Soldermask registration |
3 |
2 |
1.25 |
| Soldermask web |
3.5 |
3 |
2.25 |
| Line width-Internal (.5oz/1oz) |
2.75/3.25 |
2.5/3.0 |
2.25/2.50 |
| Spacing-Internal (.5oz/1oz) |
2.75/3.25 |
2.5/3.0 |
2.25/2.75 |
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| HDI |
| Microvia diameter |
5 |
4 |
3 |
| Microvia aspect ratio |
.75:1 |
1:1 |
1.5:1 |
| Microvia target land diamter |
10 |
8.0 |
6 |
| Microvia capture land diameter |
10 |
8.0 |
6 |
| # of build up per side |
1 |
3 |
4 |
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| Array Packaging |
| Minimum BGA pitch |
.65 mm |
.4 mm |
.3 mm |
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