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| Glossary of Terms |
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| Active Component: |
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A component that adds energy to the signal as it passes |
| Analog Circuit: |
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A circuit in which the output varies as a continuous function of the input, as contrasted with digital circuit. |
| Aramid: |
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An organic fiber vs. mineral fiber material, like E glass |
| Array: |
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Same as subpanel |
| Artwork: |
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Photoplotted film (or the Gerber files used to drive the photoplotter), NC Drill file, and documentation used to manufacture a printed circuit board |
| Assembly: |
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The process of positioning and soldering components to a printed circuit board |
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| Ball Grid Array (BGA): |
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High-density interconnect package attached to the printed circuit board with a solder ball grid |
| Bismaleimide Triazine (BT): |
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Material type |
| Blue Print: |
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See fabrication drawing. |
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| CAD: |
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See Computer Aided Design |
| CAM: |
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See Computer Aided Manufacturing. |
| Card: |
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Same as printed circuit board |
| Card-edge Connector: |
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See finger. |
| Check Plots |
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Film generated solely for checking the printed circuit board design. It is not used in the manufacturing of the board |
| Chip-on-Board (COB): |
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Integrated circuits glued and wire-bonded directly to a printed circuit board |
| Component: |
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Any of the basic parts used in building electronic equipment, such as capacitors, resistors, etc |
| Computer Aided Design (CAD) : |
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A system where engineers use a graphics screen or plot to create and view a design. In printed circuit board design, CAD files are submitted to the manufacturer. See Computer Aided Manufacturing |
| Computer Aided Manufacturing (CAM): |
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A system where manufacturers use CAD data files to drive areas of the printed circuit board manufacturing process. Types of files include Gerber files, drill files, netlists, and fab drawings |
| Conductive Anodic Filamentation (CAF): |
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An electrical short created when a conductive filament forms in the dielectric material between two adjacent conductors. |
| Connector: |
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A plug or receptacle that can be easily joined with or separated from its mate. |
| CAT Testing Conductor Analysis Technology |
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Conductor Analysis Technology is a method of benchmarking one company's capabilities against other companies through an IPC established database. Capabilities such as line width/space, hole wall quality, impedance, and registration can be assessed at certain technology levels (e.g. layer count, blind/buried vias). Results are measured by an outside source on product manufactured to capture specific market technologies |
| CE: |
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See Cyanate Ester. |
| CTE Coefficient of Thermal Expansion: |
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The tendency of a material to expand as it is heated. It is the characteristic thermo-mechanical properties of a material that dictate the amount of movement. CTE is usually reported in ppm/degree C in both the x-y (in plane,) and the z (out of plane, like a through hole) dimension. Material will move at one rate below it's Tg and at a greater rate after it passes the Tg. |
| Cyanate Ester (CE): |
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Material type. |
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| Dicyandiamide (DICY): |
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A common cross-linking agent used in FR-4 |
| Dielectric |
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Material that does not conduct electricity |
| Dielectric Constant Dk: |
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The property of a dielectric which determines the electrostatic energy stored (capacitance) per unit volume for a unit potential gradient. Also called permittivity. It really is a relative term reflecting the ratio of the speed of a signal in free space to the speed of the signal in a material via capacitance |
| Digital Circuit: |
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A circuit in which the output is non-continuous (typically "on" or "off") and can make logical decisions, as contrasted with analog circuit |
| Dissipation Factor Df: |
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The tangent of the loss angle of the insulating material. Also called the loss tangent or approximate power factor. It is a factor used to express the tendency of insulators or dielectrics to absorb some of the energy in an AC signal or looking at it another way, as the power loss of a signal in the laminate substrate only |
| Dual In-Line Package (DIP): |
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A type of housing for integrated circuits. |
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| Fab: |
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Short for fabrication. Also used as a term for printed circuit board (as in "bare fab"). |
| Fabrication |
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1. The manufacturing of a printed circuit board.
2. Point in the printed circuit board manufacturing process where the boards are routed
from the panel. |
| Fabrication Drawing: |
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A drawing that gives the printed circuit board manufacturer pertinent information regarding the board design. Often includes dimensions, tolerances, and notes on the materials and methods to be used. Also called a blueprint. |
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| IST Testing Interconnect Stress Testing: |
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IST tests and quantifies interconnect and PTH reliability and failure mechanisms. It is similar to other heating/cooling cycle test methods except that the test allows one to know when the sample tested fails and the type of failure that occurs. This allows one to quantify and baseline a process and/or product.
The test consists of electrically heating to 150 ?C in 3 minutes and of cooling to room temperature in 2 minutes a network of via and component holes. The resistance of the network is monitored through each cycle and the cycling is continued until the resistance increases by 10% indicating failure. At this point the failure site can be identified and cross sectioned and a graph of the resistance against cycles can be analyzed to identify the failure mode and point of occurrence. |
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| PPO Polyphenylene Oxide |
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Material type |
| PPE Polyphenylene Ether |
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Material type |
| PTFE Teflon |
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Material type |
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| SIR: |
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Surface Insulation Resistance |
| SEC: |
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Solvent Extraction Conductivity |
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| Tg Glass transition temperature: |
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The temperature at which laminate mechanical properties change significantly. It is not the temperature in which the glass melts. When the Tg temperature is reached, the resin changes from its "glassy" state and causes changes in the laminate's properties |
| Thermoplastic: |
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A bonding agent that bonds by melting and forming a mechanical bond in the substrate. It will reverse when the temperature reaches it melting point, but it provides the highest electrical performance. |
| Thermoset: |
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A bonding agent that results in chemical bonds that cannot be reversed once set. e.g. FR4, Getek, Speedboard C. |
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