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| rigid-flex |
- Press-Fit, SMT & Thru-Hole Assembly
- MIL-Spec, Types 1,2,3,4
- Up to 36" x 24"
- Heavy Copper (High Current Configs.)
- Passive/Active Comps.
- Integration w/ Rigid PCBs
- AOI Inspection
- X-Ray Inspection
- Level 2/3 Testing (to 44k test points)
- Design Services
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| rf/microwave |
- 1-Piece Hermetic
SMP / SMPM
- Blind Solder Interconnect
- Up to 36" x 24" PCBs via Automated Assembly
- X-Ray Testing
- RF Testing
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| heat-sink assemblies |
- Internal & External, Cu & Al Construction
- Prepreg & Adhesives (Thermally or Electrically Conductive)
- Integrated w/ SMT, Press-Fit & Thru-Hole Component Technologies
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