| Type |
Description |
Application |
 HASL
(Hot Air Solder Leveled)
|
Solder deposited on SMT features and in PTH pads and holes. Typical solder coverage to 1.5 mils on surface features. Solder thickness varies by board geometry, aspect ratio, and hole size and is therefore considered unfavorable in higher technology SMT applications. The solder coating consists of eutectic SnPb (63% / 37%)
|
Through hole / Standard SMT
|
| ENIG
(Electroless Nickel, Immersion Gold)
|
Electroless nickel-immersion gold deposited on solderable features. Typically 120-250µ in of nickel is deposited and 2-8µ in of gold. Applied after the solder mask process.
|
Standard & Fine Pitch SMT
|
| OSP
(Organic Solderability Preservative)
|
A high temperature transparent organic coating deposited on solderable features after the solder mask process. The typical thickness is 0.2 to 0.35 microns |
Standard & Fine Pitch SMT |
| Hard Gold
(full body or selective)
|
Electrolytic nickel-gold deposited on solderable features. Typically 200-400µ in of nickel is deposited, and 5- 15µ in of hard gold. Additional gold thickness (30-50µ in) can be plated in selective areas.
|
Fine Pitch SMT / Contact Pads /
Custom Components
|
| Tab Gold
(selective)
|
Electrolytic nickel-gold plated selectively on edge connectors. Nickel 100-400. Typical Au 30-50
|
Gold edge connectors
|
| Soft Gold
(full body or selective)
|
Electrolytic gold deposited to the customer's specified thickness (typically 30-50µ in). Gold deposit has a purity >99.9%, a hardness of 50-90 Knoop. Soft gold is typically applied to selective features. |
Wire bond components
|
| Immersion Silver
|
Silver combined with an organic solder preservative deposited on solderable features. Typically 6-18µ in of silver is deposited, with a nominal thickness of 15µ in. Applied after solder mask.
|
Standard & Fine Pitch SMT
|
| White Tin |
White tin is applied after solder mask.
Typically used for non-solder applications. Typical thickness is 30-50
|
Backplane |
| Combination Finishes
|
Typically a global solderable finish after a selective hard/soft gold finish has been applied. The preferred solderable finish in combination applications is OSP.
|
Component specific |
| Fused Sn/Pb
|
Eutectic solder plated onto solderable surfaces then fused with hot oil.
|
Military - Component specific
|
|
|
|
