 |
| Capabilities |
 |
| The tables below provide a general guideline of TTM Technologies' manufacturing capabilities. Deviations from the below tolerances are possible, but should undergo a design review by our engineering staff prior to order acceptance. |
|
| Density |
Standard |
Advanced & Development |
| Minimum Line/Spacing - Internal 1/2 oz |
3/3 |
2.5/2.5 |
| Mimimum Line/Spacing - External 1/2 oz |
4/4 |
3.5/3.5 |
| Minimum Drilled Hole Size |
10 |
8 |
| Minimum Soldermask Web |
4 |
2 |
| Aspect Ratio - Line Card |
12:1 |
14:1 |
| Aspect Ratio - Backplane |
14:1 |
17:1 |
| Land Size (Diameter over Drill) |
10 |
8 |
| Thickness (Minimum / Maximum) |
30 / 300 |
20 / 440 |
| Thickness Tolerance |
+/- 10 |
+/- 7 |
| Layer to Layer Registration |
+/- 5 |
+/- 3 |
| Minimum Core Thickness |
3 |
2.5 |
| Minimum Core Thickness (BC) |
2 |
1 |
| Minimum Prepreg Fill |
2.5 |
2 |
| BGA |
1.0 mm |
.4 mm |
| QFP |
.65 mm |
.5 mm |
|
|
|
| HDI & VIAS |
Standard |
Advanced & Development |
| BBV Mechanical Drill |
8 |
6 |
| Back Drilling Depth Tolerance |
+/- 8 |
+/- 5 |
| Minimum Laser Via (Drill / Capture Pad) |
5 / 12 |
4 / 10 |
| Variable Depth Laser Via (Depth / Diameter) |
9 / 12 |
9 / 10 |
| Microvia Aspect Ratio |
0.75:1 |
1:1 |
| 1 Layer Build Up |
Yes |
|
| 2 Layer Build Up |
|
Yes |
| 3+ Layer Build Up |
|
Yes |
|
|
| |
| Controlled Impedance |
Standard |
Advanced & Development |
| 28 - 150 Ohms |
+/- 10% |
+/- 5% |
| 50 - 150 Ohms |
+/- 10% |
+/- 8% |
|
|
| |
| Copper Weights |
Standard |
Advanced & Development |
| Min Base Copper - plated layers |
1/2 oz |
1/4 oz |
| Max Base Copper - plated layers |
2 oz |
10 oz |
| Min Copper Foil - non plated layers |
1/2 oz |
1/8 oz |
| Max Copper Foil - non plated layers |
2 oz |
12 oz |
|
|
| |
