Technology Specialist - prototype through production volumes. 4 - 68 layers, advanced substrates, large / thick multilayers, specialty platings, controlled impedance, buried resistors, and oversize panel capability to 30"x55", Rigid-Flex, and Advance RF PWB's.

Certification:

ISO 9002 Certified Supplier (1994), UL 94VO Listed, MIL-P-55110, MIL-PRF-31032, MIL-P-50884

Manufacturing Capabilities:

Prototype:

2 - 20 layers 20+ layers

72 hours 5 - 15 days

Production:

2 - 68 layers

3 - 5 weeks

Line & Space:

0.004" / 0.004" IL
0.005" / 0.005" OL

SMT Pitch:

.8mm BGA

BGA Pitch:

0.039"

Hole Size:

.008 drill through Via (drilled)
.006 drill buried/blind via (drilled)
.005 drill microvia (drilled)

Daughter Card: "9:1
Backplane: "13:1

Ohmega Ply and Carbon Ink

Buried, Blind, Microvia:

Prototype and Production

Material:

High Tg Fr-4, Nelco -11, -12, 13, -13SI, Getek, Megtron, Rogers 4350, Halogen Free FR-4, Thermount CLTE, Rogers 3003, 6002, Speedboard C, FEP, Copper-Invar-Copper, Kevlar, Cyanate Ester, BT, Polyimide, Adhesive less Flexible Polyimide, Acrylic Coated Flexible Polyimide

4350, 4003, PTFE, 3003, 6002, CLTE, Speed Board C, PPE / SI Glass

Buried Capacitance: ZBC2000
Buried Resistance: Ohmega ply 25 ohm, 50 ohm, 100 ohm
Screen ink resistor all values

Panel Sizes:

12" x 12" through 24" x 42"

PCB Thickness:

.440" Maximum Prototype
.440" Maximum Production

LeaPonal LPI, Taiyo LPI
Dupont .003 & .004 Dry film
Conframask .002 dry film

HASL, Hot Oil Reflow, Selective Solder Strip, Nickel / Gold Tabs, Electrolytic Nickel, Hard Gold, Soft Gold, Electroless Nickel / Immersion Gold, Organic Solderability Preservative (OSP), Immersion Silver