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Core Business:
Backplane Assembly, Card Cage / Box Build, Sub-System / System Integration. Quick Turn, Prototype, Pre-Production, Volume Production Assembly.
Certification:
ISO 9002 Certified, UL Approved
Quality Control and Testing Capabilities:
- Testronics model 401 Level II & III testing
- HP 3070 L III & IV Tester (Q4)
- Tektronix Oscilloscope & TDR modules
- Microscopes: optical & laser section
- Bar code scanning system
- ISO 9002 Certified
- Telcordia TL9000 compliant 2001
Manufacturing Capabilities:
Product Type:
- Customer Backplane Assemblies
- Press Fit
- Surface Mount
- Wave and Hand Solder
- In Circuit Test and X-Ray
- AOI Assembly Inspection
- Sub-System Integration
- Full System Assembly and Test
- Commercial and Military Applications
Process Capabilities:
- 2 ASG (6T & 12T) computer controlled connector insertion machines
- 2 MAP Auto insertion machines (8/00)
- MyData MD 12 Chip Shooter
- Stencil printer & in line reflow unit.
- Technical Devices wave solder machine & aqueous cleaner
- Prototype assembly line.
- Thick assembly (>0.400" /10mm) capability
- Large panel (24" x 30" / 620mm x 750mm) capability
- System integration: card cage, racks, cabinets, cables
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Level 2, Hongcao Building
No. 421 Hongcao Road
Caohejing, Shanghai, China
Tel: 86 21 649 54 551
Fax: 86 21 649 55 236
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