Quick turn around service on prototype and pre-production PCB's up to 24 layers.
Expertise in high technology, high reliable designs for Military applications.
Technology includes rigid PCB's, Rigid flex, Microvia technology, and buried capacitance.

Certification:

MIL-P-55110, MIL-PRF-50884, and MIL-PRF-31032

Manufacturing Capabilities:

Prototype:

2 - 10 layers	48 hours
12 - 16 layers	72 hours

Production:

2 - 24 layers

3 - 5 weeks

Line & Space:

0.004"/0.004" IL

0.004"/0.004" OL

SMT Pitch:

Hole Size (finished):

.010 drill through Via (drilled)
.008 drill buried/blind via (drilled)
.005 drill microvia (drilled)

Daughter Card: "7:1

Blind and Buried Via: Prototype through production

Buried Capacitance:

ZBC-2000

Material:

High Tg Fr-4, Nelco -11, -12, 13, -13SI, Getek, Megtron, Rogers 4350, Halogen Free FR-4, Thermount BT, Polyimide, Adhesiveless Flexible Polyimide, Acrylic Coated Flexible Polyimide

Buried Capacitance: ZBC 2000

.028 - .250

LeaPonal LPI, Taiyo LPI
Dupont .003 & .004 Dry film
Conframask .002 dry film

.014" DS - 4 layers	.093" DS - 20 layers
.018" DS - 6 layers	.125" DS - 30 layers
.062" DS - 12 layers	.250" Maximum

Surface Finishes:

HASL, Hard Gold Electroplate, Electroless Nickel / Immersion Gold, Organic Solderability Preservative (OSP), Immersion Tin