RF Technology - quick turnaround production volumes. 2-24 layer capability, microwave materials specialists, thin to very thick laminates, specialized equipment and plating for RF product.

Certification:

ISO 9002 Certified Supplier (1995), MIL-PRF-55110

Manufacturing Capabilities:

Prototype:

2 - 10 layers

72 hours

Pre-Production / Production:

2 - 28 layers

3 - 5 weeks

Line & Space:

0.004" / 0.004"

SMT Pitch:

0.016"

Hole Size (finished):

.010 drill through Via (drilled)
.008 drill buried/blind via (drilled)

Aspect Ratio:

5:1 Teflon laminate
8:1 Non-Teflon filled laminate

High Tg Fr-4, 13, Rogers 4350, Speedboard C, FEP. Rogers 3003, 6002, TMM10, GX, GY

.020 - .310

12" x 12" through 24" x 36"
26" x 36"

PCB Thickness:

0.310" Maximum
Dupont Vacrel, Dynachem KM and Conformask, Enthone LPI

HASL, Hot Oil Reflow, Selective Solder Strip, Nickel / Gold Tabs, Electrolytic Nickel, Hard Gold, Soft Gold, Electroless Nickel/Immersion Gold, Organic Solderability Preservative (OSP)

LeaPonal LPI, Taiyo LPI
Dupont .003 & .004 Dry film
Conframask .002 dry film