High Technology, Quick turnaround services on prototype - medium production PCB and backplanes. High End Daughter Cards up to 30 layers. Backplanes to 40 layers.

Certification:

ISO 9002 Certified Supplier (1994), Bellcore Compliant, UL 945V0 Listed

Manufacturing Capabilities:

Prototype:

2 - 14 layers 16 - 18 layers 20 - 30 layers

24 hours 48 hours 72 hours

Production:

2 - 30+ layers

3 - 5 weeks

Line & Space:

0.003"/0.003" IL

0.004"/0.004" OL

SMT Pitch:

.8mm BGA

Hole Size (finished):

.008 drill through Via (drilled)
.006 drill buried/blind via (drilled)
.005 drill microvia (drilled)

Microvia:

0.004

Aspect Ratio (drilled):

Daughter Card: "11:1
Backplane: "13:1

Blind and Buried Vias:

Prototype and Production

Buried Capacitance:

ZBC-2000

Buried Resistors:

Ohmega-Ply

Material:

High Tg Fr-4, Nelco -11, -12, 13, -13SI, Getek, Megtron, Rogers 4350, Halogen Free FR-4, Thermount

Embedded Devices:

Buried Capacitance: ZBC2000, ZBC1000, HK4
Buried Resistance: Ohmega ply 25 ohm, 50 ohm

Soldermask:

LeaPonal LPI
Dupont .003 & .004 Dry film
Conframask .002 dry film

Surface Finishes:

HASL, Immersion Gold, Organic Solderability Preservative (OSP), Electroless Nickel / Immersion Gold, Immersion Silver