| Core Business:
Volume PCB's from 2 layers up to 20 layer daughter cards and 30+ layers backpanels.
Certification:
ISO 9002 Certified Supplier (1994), Bellcore Compliant, UL 945V0 Listed
Manufacturing Capabilities:
Prototype:
2 - 14 layers
16 - 18 layers |
72 hours
5 - 10 days |
Production:
| 2 - 30+ layers |
3 - 5 weeks |
Line & Space:
| 0.004"/0.004" IL |
0.004"/0.004" OL |
SMT Pitch:
1mm BGA
BGA Pitch:
0.039"
Hole Size (finished):
.008 drill through Via (drilled)
.006 drill buried/blind via (drilled)
Aspect Ratio (drilled):
Daughter Card: "10:1
Backplane: "13:1
Blind and Buried Vias:
Blind Vias
Material:
High Tg Fr-4, Nelco -11, -12, 13, -13SI, Getek, Megtron, Rogers 4350, Halogen Free FR-4, Polyimide
PWB Thickness: .028 - .350
PCB Thickness:
| 0.018" DS-4 layers |
0.093" DS-16 layers |
| 0.031" DS-6 layers |
0.125" DS-16 layers |
| 0.062" DS-14 layers |
0.250" Maximum |
Soldermask:
LeaPonal LPI, Taiyo LPI
Dupont .003 & .004 Dry film
Conframask .002 dry film
Dry Film Soldermask:
Shipley 5900 and Taiyo LPI
Surface Finishes:
Component and Turnkey Assembly Available, HASL, EntekCu106A, Immersion Gold, Immersion Silver
Electrical Test:
| Net list testing |
Double Density /
dual access fixtures |
| Voltage |
10 - 250 volts |
| Isolation |
1 ohm - 10 megaohms |
| Continuity |
1 - 1,000 ohms |
| Impedance |
Single ended and differential |
|
710 North 600 West
Logan, UT 84321
Tel: (435) 753-4700
Fax: (435) 753-7544
|
